| 摘要 |
The invention relates to a process and device for encapsulating microwave modules. The process consists in sealing to the glass 12, on an alumina substrate 1 carrying a thick layered hybrid circuit, an alumina frame 6 metallised 7 on the exterior lateral faces and on the upper edge. Closure with a Kovar cover 10 is carried out by fixing an auxiliary Kovar metal frame 9 by brazing 8 to the alumina frame without bare integrated-circuit chips which are to be mounted on the hybrid circuit. After cleaning the housing and mounting the chips, the housing is closed by electric roller spot welding of the cover 10 to the frame 9, thereby preventing pollution of the inside of the housing. The invention applies to the encapsulation of microwave modules. <IMAGE> |
