| 摘要 |
<p>PURPOSE:To absorb and buffer thermal stress with a buffer film to prevent occurrence of plastic crack at the foot of a leadframe by a method wherein the foot of the leadframe is held by a plastic package via the buffer film. CONSTITUTION:A Hall element chip 10 is mounted on a chip mount 5a of a leadframe 5 and electrically connected to respective leadframes 2, 3, 4, 5 with metallic wires 11. The leadframes 2, 3, 4, 5 are made of material such as phosphor bronze and formed in planar shapes. the surrounding of the chip 10 is molded by a plastic package 7. The plastic package 7 is made of epoxy resin, polyimide resin or the like. The leadframes 2, 3, 4, 5 are insert-molded in the plastic package 7 with parts of buffer films 6 applied on the leadframe 2, 3, 4, 5 left, and the feet of the leadframes 2, 3, 4, 5 are held by the plastic package 7 via the buffer films 6. These buffer film 6 prevents cracks from occurring on the plastic package 7 at the feed of the leadframes 2, 3, 4, 5.</p> |
