发明名称 STRUCTURE FOR COOLING INTEGRATED CIRCUIT
摘要 PURPOSE:To stabilize cooing effect and improve heat conduction by a method wherein a heat conductor sheet is attached to a face in contact with an integrated circuit of a flange and a plurality of grooves are made on one side of a fin. CONSTITUTION:When an integrated circuit case 1 is mounted on a printed circuit board 3, a flange 2 provided with an elastic heat conductive sheet 5 is interposed between the integrated circuit case 1 and the printed circuit board 3. A male screw 10 provided on the upper side of a fin 6 is screwed through a through hole 8 punched in the printed board 3 into a female screw part provided on the flange 2. Further thermal compound 7 is filled in a recess for storing a groove 11 of a fin 6 provided on a cold plate 4 where coolant for cooling flows inside, and the cold plate 4 is attached to the lower side of the printed circuit board 3. Heat generated from the integrated circuit is transferred from the integrated circuit case 1 via the heat conductive sheet 5 in the flange 2 to the fin 6 and then transferred to the cold plate via the thermal compound 7.
申请公布号 JPH02301159(A) 申请公布日期 1990.12.13
申请号 JP19890122416 申请日期 1989.05.15
申请人 NEC CORP 发明人 MARUYAMA KAZUO
分类号 H01L23/473;H01L23/36 主分类号 H01L23/473
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