发明名称 LEAD FRAME FOR OPTICALLY COUPLED DEVICE
摘要 <p>PURPOSE:To prevent terminals from coming in contact with tie bars by arranging headers, which are installed on a pair of frames, to mount chips face to face and joining said headers with the tie bars intersecting the direction of the projection of the terminals through the terminals projected on the headers. CONSTITUTION:When a first frame 1 and a second frame 2 are arranged to place the headers 11a and 21a thereof face to face, the leads 11c, 12c, 21c, and 22c of the frames 1 and 2 can be arranged on one plane. In this time, the tie bars 13 and 23 of the frames 1 and 2 face each other with the headers 11a and 21a therebetween, therefore, are not in contact with terminals 11b, 12b, 21b, and 22b. After the frames 1 and 2 are thus arranged in the specific positions, molding is performed and the tie bars 13 and 23, bridging pieces 14, 24, and 25, and connection pieces 21d and 22d are cut.</p>
申请公布号 JPH02301168(A) 申请公布日期 1990.12.13
申请号 JP19890121102 申请日期 1989.05.15
申请人 MATSUSHITA ELECTRIC WORKS LTD 发明人 YAMAGUCHI SHUICHIRO;IRIE TATSUHIKO;HIMURA YOSHIMASA;IITAKA YUKIO;MATSUMOTO TAKESHI
分类号 H01L23/48;H01L31/12 主分类号 H01L23/48
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