发明名称 MEASURING METHOD OF PLATE THICKNESS
摘要 PURPOSE:To measure the thickness with high accuracy, by separately compensating the dose of radiant rays of a plate to be measured consisting of a base and a plating layer with the base plate eliminating the plating layer, the type of material of the plating layer and the plating compensation. CONSTITUTION:Radiant rays irradiated from a radiant ray source 1 transmit a plate to be measured 2 consisting of plating layers 32, 33 and a base plate 31 and reach an ionization chamber 3. The output is given to a microcomputer 22 via a preamplifier 4 and an AD converter 21. The microcomputer 22 has data required for the correction of type of material and plating compensation for the base plate 31 and the plating layers 32 and 33 from a plate thickness setter 24, a type of material compensation setter 25, a plating amount setter 26, allowing to made computations such as convertion of transmitted amount data into logarithm, compensation of type of material, calculation of deviation, and plating compensation calculation. The thickness can be computed with high accuracy and output is obtained via a DA converter 23.
申请公布号 JPS57197408(A) 申请公布日期 1982.12.03
申请号 JP19810081947 申请日期 1981.05.29
申请人 TOKYO SHIBAURA DENKI KK 发明人 MASANOBU KAZUNORI
分类号 G01B15/02;G01N23/06 主分类号 G01B15/02
代理机构 代理人
主权项
地址