| 摘要 |
A die exchanger of a molding apparatus includes a die plate, a die carrying-in apparatus and a die carrying-out apparatus. The die carrying-in apparatus has at least one guide groove engaging a pin of the die and guiding a plurality of corresponding dies and has a first support plate movable forward and backward to the die plate so that the guide groove is connectable to a groove in clamp means provided on the die plate. The die carrying-out apparatus has a second support plate movable forward and backward to the die plate so that the second support plate can receive the die engaging the clamp, the second support plate movably supporting the die. The die carrying-in apparatus has a one-way feed mechanism feeding each of the corresponding dies which is supported by means of the guide groove of the first support plate to the die plate. The die carrying-out apparatus is tiltable for discharging the die.
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