发明名称 |
Process for metallizing non-conductive substrates |
摘要 |
Non-conductive surfaces, particularly through-hole surfaces in double-sided or multi-layer printed circuit board, are treated (conditioned) to receive void-free, adherent electroless metal coatings by contact of the surfaces with an organosilane preparatory to catalyzation and metallization.
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申请公布号 |
US4976990(A) |
申请公布日期 |
1990.12.11 |
申请号 |
US19890331039 |
申请日期 |
1989.03.29 |
申请人 |
MACDERMID, INCORPORATED |
发明人 |
BACH, WOLF;FERRIER, DONALD R.;KUKANSKIS, PETER E.;WILLIAMS, ANN S.;SENECHAL, MARY J. |
分类号 |
C23C18/18;C23C18/20;C23C18/28;H05K3/38;H05K3/42 |
主分类号 |
C23C18/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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