ONE-SIDED PRINTED BOARD WHERE ELECTRIC AND/OR ELECTRONIC PARTS ARE MOUNTED, AND ITS MOUNTING METHOD ,AND CONNECTING ELEMENT USED FOR MOUNIT-ING METHOD

摘要

PURPOSE: To improve the reliability of a soldered junction by mounting SMD parts and a connecting element on a printed board by reflow soldering and connecting the wires of wire parts to the connecting element by fluid soldering. CONSTITUTION: On a single-side printed board on which surface mounting device(SMD) parts 7 and 11 are mounted on a track side A, wire parts 17 are also provided on the track side A. Namely, after solder has been mounted on soldering surfaces 3, the parts 7 and 11 and a connecting element 25 are provided. First, a soldered junction 29 is obtained by performing a reflow soldering process. Then a fluid soldering process is performed with the track surface A of the printed board on the top side after the connecting wires 19 of the wire parts 17 have been inserted into soldering bushes 25. As a result of this, highly reliable soldered connecting sections 29 and 31 can be formed.