| 摘要 |
SOLDERING PINS INTO PRINTED CIRCUIT BOARDS of the disclosure Soldering splined pins into holes in printed circuit boards by providing small volumetric gaps between the splines to allow thin layers of solder lining, the holes to be sufficiently thick to block the gaps during solder flow. The solder may have a maximum thickness of 0.001 inches to block the gaps unassisted by additional solder. |
