发明名称 METHOD OF COVERING SIDEWALL OF CAVITY OF SUBSTRATE
摘要 PURPOSE: To fill up the cavity of a substrate or to coat the the walls of the cavity by providing a material on the substrate having the cavity inside and allowing the material to flow and adhere to the internal surface of the cavity, and then, giving such an environment that presses the material against the internal surface of the cavity. CONSTITUTION: After surfaces 2 and 4 of a substrate 10 are respectively covered with material layers 6 and 8, a through-hole 12 is formed in a structure 14, so that the materials 6 and 8 can flow and an environment that presses the materials 6 and 8 covering sidewalls 18 of the cavity 12 against the sidewalls 18 and forms the materials 6 and 8 in a thick layer for a long time is given. The materials 6 and 8 start to flow along the sidewalls of the through-hole 12 and becomes thicker as the materials 6 and 8 move toward the center of the hole 12 and, as a result, the hole 12 is completely filled up with the materials 6 and 8. Therefore, the sidewalls 18 of the cavity 12 of the substrate 10 can be coated, or the cavity 12 can be filled up completely with the materials 6 and 8.
申请公布号 JPH02299291(A) 申请公布日期 1990.12.11
申请号 JP19900097820 申请日期 1990.04.16
申请人 INTERNATL BUSINESS MACH CORP <IBM> 发明人 CHIYAARUZU ROPAATO DEIBISU;RONARUDO DEIIN GOORUDOBURATSUTO
分类号 H05K3/28;B23K26/38;H05K1/05;H05K3/44 主分类号 H05K3/28
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