| 摘要 |
<p>PURPOSE:To assemble a semiconductor element, whose fine processing property is excellent, of a type having very many pins and of a memory type where inner leads are difficult to guide and to eliminate a drop in a yield by a method wherein the inner leads are formed on a circuit substrate. CONSTITUTION:A plurality of inner leads 18 composed of a metal wiring layer are formed on a circuit substrate 17; a semiconductor element 13 is fixed directly onto the inner leads 18 on the circuit substrate 17 by using an insulating adhesive layer 14. The semiconductor element 13 is connected to the inner leads 18 on the circuit substrate and the inner leads 18 on the circuit substrate are connected to lead frames 12 by using bonding wires 15. Thereby, the inner leads 18 can be formed on the circuit substrate 17 with good accuracy, and the semiconductor element can be fixed onto the inner leads 18.</p> |
