| 摘要 |
<p>PURPOSE:To prevent chipping for damaging part of a material by securing a substrate to be cut to a dicing tape through a pad member having higher hardness than that of the tap, and cutting it with a dicing plate. CONSTITUTION:The lower face of a substrate 1 to be cut is adhered to the upper face of a pad member 2 with wax or the like. The member 2 is adhered to a thin dicing tape 3 having an adhesive layer 31 on its upper face, the tape 3 is vacuum sucked by a bed 4 thereby to secure the substrate 1 to a dicing unit. A dicing plate 5 rotating at a high speed is moved to completely cut the substrate 1 to be cut. The member 2 is made of a material such as silicon, etc., having higher hardness than that of the tape and slightly larger thickness than a cutting depth.</p> |
