| 摘要 |
PURPOSE: To provide a composite array, wherein small chips aligned accurately and precisely in a line by attaching chips to a specified positions on a substrate, where a thermal activation bond and an optical hardening bond have been applied, and being held temporarily with the optical hardening bond for heating, so that the thermal activation bond hardens. CONSTITUTION: On a place where each chip 5A-5N on a metal coat 8 of a substrate 6 is attached, a thermal activation/thermal thermoplastic conductive bond 20 is applied, while an optical hardening bond 22 is applied to a nearby but separated place. With the chip 5A at a specified position, the optical hardening bond 22 is exposed to an ultraviolet ray for hardening, so that a hard fillet- like bridge 34 of a bond is formed. After the chips 5B-5N have been likewise hardened, held temporarily at a specified position with the bond 22, then heated to a required temperature for hardening the thermal activation bond 20, with the chips 5A-5N fixed permanently at specified position. Thus, the small chips 5A-5N are butted together, end to end for bonding, and a long image sensor array 4 is manufactured without degrading image quality. |
