| 摘要 |
PURPOSE:To prevent droop of a wire by providing a support part for restricting said droop. CONSTITUTION:A ceramic package 11 is covered with a cap 18, and a semiconductor chip 12 is sealed in the ceramic package 11. A wire holding surface 19 is provided on the ceramic package 11, and a wire 17 is laid along the wire holding surface 19. Accordingly, even when the wire 17 droops owing to any chock and any temperature change, the wire 17 is supported by the wire holding surface 19. Hereby, the droop of the wire 17 can be prevented. |
