| 摘要 |
<p>In this invention, a laser chip (3) is directly disposed on a support member through mounting means, and the support member, the laser chip (3), and peripheral parts thereof are integrally sealed with transparent plastic resin. In this structure, without requiring expensive materials and parts, a semiconductor laser apparatus may be manufactured by using the same materials and process as in the ordinary plastic-sealed LED, so that the cost may be reduced significantly.</p> |
