| 摘要 |
<p>PURPOSE:To prevent dust particles produced by a rubbing between a wafer face and a contact face at a taking-out and housing operation of a wafer from adhering and to enhance a yield by a method wherein a longitudinal groove is dug in the rear surface of a metal thin sheet, the groove is closed with a metal tape and a vacuum suction sheet constituted so as to form a vacuum flow route is installed. CONSTITUTION:A longitudinal groove machined part in the rear of a vacuum suction sheet 2 whose rigidity is strong and which is formed of a metal thin sheet is closed with a metal tape 1; a vacuum flow route (differential pressure chamber) 3 is formed. A vacuum suction pat made of quartz is filled into a groove part which has been dug in the upper part of the vacuum suction sheet 2; it is fixed by using an adhesive. A hole 4' made in the vacuum suction pat 4 made of quartz and the vacuum flow route 3 are connected by means of a small-diameter hole 2'. In addition, guides 2 made of quartz are arranged at tip parts of the vacuum suction sheet 2 so as to be balanced with the center of gravity of a semiconductor wafer 5 in such a way that the wafer 5 does not fall when a vacuum is broken; the vacuum suction sheet 2 of an extremely thin structure is constituted.</p> |
