| 摘要 |
PURPOSE:To improve the adhesion of a copper foil circuit layer to a resin by a method wherein a treatment for the formation of a copper oxide film is performed on the surface of the copper foil circuit layer and after this formed copper oxide film is reduced, the film is treated with a specified organic silicon compound solution. CONSTITUTION:This manufacturing method is a method wherein a copper oxide film is formed on the surface of a copper foil circuit layer, then, the copper oxide film is reduced and moreover, is treated with a liquid containing a silane coupling agent which is represented by RSiX3 (R is an organic functional group and X is a hydrolyzable group). The formation of the copper oxide film is possible by performing a treatment on the surface of the conductor circuit layer with a sodium chlorite treating liquid, an ammonium persulfate treating liquid or a copper acetate treating liquid. Then, among methods of reducing the formed copper oxide film are a sodium borohydride method and the like. The silane coupling agent is vinyltrichlorosilane, vinyltriethoxysilane, vinyl-tris (beta-methoxy) silane or gamma-glycidoxypropyltrimethoxysilane. These silane coupling agents can be used as an aqueous solution or an organic solvent solution, such as alcohol, acetone, methyl acetate and the like. Thereby, the adhesion of the copper foil circuit layer to a prepreg resin can be improved. |
