发明名称 ADHESIVE COMPOSITIONS CONTAINING LOW MOLECULAR WEIGHT POLYPHENYLENE OXIDES
摘要 Pressure sensitive and hot melt adhesive compositions having improved shear adhesion failure temperatures (SAFT) comprising: a) a block copolymer having at least two monoalkenyl arene polymer endblocks A and at least one elastomeric conjugated-diene midblock B, said blocks A comprising 8-55 % by weight of the block copolymer; b) about 50 to about 200 phr of a tackifying resin compatible with block B; and c) about 5 to about 50 phr of a low molecular weight polyphenylene oxide polymer wherein the molecular weight (Mvis) of the polyphenylene oxide polymer is from about 1,000 to about 5,000, the Tg is from about 100 DEG C to about 165 DEG C, preferably between 140-163 DEG C.
申请公布号 WO9014397(A1) 申请公布日期 1990.11.29
申请号 WO1990US03057 申请日期 1990.05.23
申请人 EXXON CHEMICAL PATENTS INC. 发明人 AUDETT, JAY, DOUGLAS
分类号 C08L53/02;C08L53/00;C08L71/12;C09J153/00;C09J153/02;C09J171/00;C09J171/12 主分类号 C08L53/02
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