发明名称 ADHESIVE COMPOSITIONS CONTAINING LOW MOLECULAR WEIGHT POLYPHENYLENE OXIDES
摘要 Pressure sensitive and hot melt adhesive compositions having improved shear adhesion failure temperatures (SAFT) comprising: (a) a block copolymer having at least two monoalkenyl arene polymer endblocks (A) and at least one elastomeric conjugated-diene midblock (B), said blocks (A) comprising 8-55 % by weight of the block copolymer; (b) about 50 to about 200 phr of a tackifying resin compatible with block (B); and (c) about 5 to about 50 phr of a low molecular weight polyphenylene oxide polymer wherein the molecular weight (Mvis) of the polyphenylene oxide polymer is from about 1,000 to about 5,000, the Tg is from about 100 DEG to about 165 DEG C, preferably between 140-163 DEG C.
申请公布号 WO9014396(A1) 申请公布日期 1990.11.29
申请号 WO1990US02948 申请日期 1990.05.23
申请人 EXXON CHEMICAL PATENTS INC. 发明人 AUDETT, JAY, DOUGLAS
分类号 C08L53/02;C08L53/00;C08L71/12;C09J153/00;C09J153/02;C09J171/00;C09J171/12 主分类号 C08L53/02
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