| 摘要 |
PURPOSE:To prevent the contamination of a body to be treated, and improve rising characteristics of temperature processing time, by arranging many protrusions and recesses on the surface side of a temperature processing plate, retaining the body to be treated by the protrusions, and performing direct tem perature control on the protrusions and radiation temperature control on the recesses. CONSTITUTION:After a wafer 24 is retained at three points on a hot plate 10 by protruding pins 12, said pins 12 are made to descend and the wafer is mounted on the plate 10. Thereby the wafer 24 is retained in the manner of line contact by mountain top points of protruding parts 16 of the plate 10 whose temperature is controlled, and baking is started. As a result, processing provided with both merits of direct temperature control system and proximity temperature control system is enabled, so that the contamination of a body to be treated can be prevented and rising characteristics of temperature processing time can be improved. |
