| 摘要 |
<p>PURPOSE:To obtain a face packaging type semiconductor device which can be manufactured economically, by a method wherein the outside opposite connection end parts of a lead wire of a coaxial two-terminal type semiconductor device are machined to be shaped in plates and further are bent so that the lower surfaces of these two plate-shaped parts form one face. CONSTITUTION:A semiconductor pellet 11 is fitted firmly between the headers of a double pin head type lead wire 12 by soldering or the like. The headers and the semiconductor pellet are mold-coated in the shape of a cylinder with sealing resin 13 so that they are packed up therewith. Next, the lead wire is cut in a prescribed length and then machined to be shaped in a flat plate 14. The lead wire is bent (formed), in succession, so that the lower ones of the surfaces thereof machined to be flat form one face, and thereby a face packaging type semiconductor device is completed.</p> |
