| 摘要 |
PURPOSE:To make it possible to coat uniformly the back of a semiconductor chip by a method wherein a recessed part not enclosing but being continuous is provided in the bottom of a nozzle for discharging a bonding agent, a conductive bonding agent is discharge in a state wherein the bottom of the nozzle is brought into contact with a coated surface and then the conductive bonding agent is applied for coating by detaching the bottom of the nozzle from the coated surface. CONSTITUTION:First a nozzle 1 for discharging a bonding agent is so disposed as to be positioned vertically above a die pad 2. Next, the bottom of the nozzle 1 for discharging the bonding agent is brought into contact with the die pad 2. A pneumatic apparatus for discharging a prescribed quantity of liquid being operated in this state, a prescribed quantity of conductive bonding agent 41 is discharged into a recessed part 9 having two grooves intersecting, which is provided in the lower part of the nozzle 1. In the case when the agent is used for a square semiconductor chip of a 5mm side, for instance, the quantity of discharge needs only to be about 0.01cc. The nozzle for discharging the bonding agent is set stationary in this state until the conductive bonding agent 41 is made stable, and the time therefor needs only to be about 10ms or above. Thereafter the bottom of the nozzle 1 for discharging the bonding agent is detached from the die pad 2, so that the conductive bonding agent 41 is applied in the shape of the recessed part 9, on the surface of the die pad 2.
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