| 摘要 |
<p>A process is described for the provision of a mark or design in a plastic film (2) in the form of a relief pattern, in which the film is at least partially deformed under the influence of heat and pressure by providing recesses which may or may not be perforated, using a stencil (1) provided with perforations (3, 4), and the mark or design is formed in the plastic film (2) by deforming the film material at least along the periphery of the mark or design, in such a way that the mark or design, unlike the deformed part of the film, is not perforated, said relief being provided by using a perforated stencil (1) whose non-perforated surfaces are raised parts formed on the stencil (1), comprising a coating (5) applied to the stencil (1). The coating is preferably a photoresist layer.</p> |
