| 摘要 |
PURPOSE:To make it possible to prevent an opening section provided to an insulating layer from being closed due to blots and sags during printing work and form a fine viahole definitely by providing a projection to such parts which are associated with the connection between a lower part semiconductor and an upper part conductor. CONSTITUTION:A projection 36 is integrated into a substrate 31 previously in a position where a viahole is to be formed. A lower conductor 32 is formed based on a printing method on this substrate 31. An insulating layer 33 is print- formed so that the position of its opening section 35 may fall in line with the projection 36. Then, the connection related section between an upper part conductor 34 and the lower part conductor 32 is lowered from the opening section 35 upon the lower part conductor 32, thereby forming a connection viahole. It is, therefore, possible to make exposed from the opening section a projecting part of the lower part conductor 32 since the projecting part is elevated higher than the surrounding parts and easily adhered to a screen even if blot or sag is generated on the insulating layer 33. This constitution can prevent the opening section from being closed due to blot or sag during the insulating layer printing, thereby obtaining satisfactory fine viaholes. |
