| 摘要 |
PURPOSE:To superpose a semiconductor wafer and a reticle with high accuracy by simply changing the pattern of a wafer-alignment-mark. CONSTITUTION:A reticle (such as a reticle 4) with rectangular reticle-windows (such as reticle-windows 4A) and a semiconductor wafer (such as a semiconductor wafer 1) to which a wafer-alignment-mark (such as a wafer-alignment-mark 2) having a pattern, which is made to correspond in the longitudinal direction of the reticle-windows and in which dots (such as square-shaped dots 2X1, 2X2...) are displaced and arranged in a stepped form, is shaped are faced oppositely. Either one of the semiconductor wafer or light is moved in the direction orthogonal to the longitudinal direction of the reticle-windows and the wafer-alignment- mark while the wafer-alignment-mark is irradiated with light through the reticle- windows, and the semiconductor wafer and the reticle are aligned. |
