CONTACT SYSTEM FOR 2-POLE ELECTRONIC CHIPS, IN PARTICULAR FOR SEMI-CONDUCTOR CHIPS

摘要

In a contacting system for bipolar electronic circuit elements, more particularly semiconductor circuit elements, in which a circuit element body provided on at least one of two major surfaces located opposite each other with a thick, pressure-contact layer is held under pressure between two contact bodies interconnected by a housing, more particularly a soft glass housing. The risk of contact interruptions with frequent temperature variations in a range of from 0 DEG to 300 DEG C. is eliminated in that the thick pressure contact layers are subdivided into several contact blocks, preferably three or four, which are mutually separated and arranged beside each other. The surface of the contact blocks facing the contact bodies may be coated with a connection layer, which serves to establish during sealing into a soft glass envelope a connection by soldering or diffusion welding between the contact blocks and the contact bodies.