| 摘要 |
PURPOSE:To reduce external effect and to form a circuit pattern in high density by providing a strip conductor inside a dielectric layer, and building in a conductor line. CONSTITUTION:According to the one of structures of dielectric circuit substrates, first, conductive paste is printed on a dielectric green sheet formed in specified thickness, by doctor blading method, etc., or on the surface of a laminate wherein dielectric paste is stacked in the specified thickness, by a printing method, etc. As a ceramic dielectric 3, it is laminated using, preferably, Ba2Ti9O20, TiO2, Al2O3, etc., by a sheet method, printing method, etc. A grounding conductor 2 is formed by printing, preferably, platinum, palladium, silver, etc., or those alloy on the surface of the dielectric. For a strip conductor 1, it is printed on the surface of the dielectric similar to the grounding conductor, and then a dielectric is laminated thereon. |
