| 摘要 |
PURPOSE:To enable the oblique mounting at the angle corresponding to the height limitation of mounting space so as to realize high density mounting high in reliability by mounting semiconductor elements on both faces of a substrate so that the semiconductor element on one face may be positioned farther from an external electrode at the edge face of the substrate than the semiconductor element on the other face. CONSTITUTION:A semiconductor device 1 is of structure where a plurality of pieces of SOJ(small outline J-bend package)-shaped semiconductor elements 3a and 3b are mounted on both primary faces 2a and 2b of a printed wiring substrate 2 in multilayer interconnection structure, and is mainly used as a memory module for computer, etc. The semiconductor element 3a mounted on the top 2a of the substrate 2 is mounted being slid by the amounts of l-m from the position corresponding to the semiconductor element 3b mounted on the bottom 2b to the position near an external electrode terminals 5. The mounting of the semiconductor elements 3a and 3b on the substrate 2 is done by fixing J-shaped leads 4a and 4b projected from the semiconductor elements 3a and 3b to the electrode pads 8a and 8b on the substrate 2 with solder, etc. |
