| 摘要 |
PURPOSE:To eliminate package cracks during soldering, to prevent wire disconnection and deterioration of reliability, to improve heat dissipation, and to prevent malfunction, lowering of characteristics, and damage of an IC chip by attaching a metal piece to a surface of a synthetic resin with an engagement after resin sealing. CONSTITUTION:An IC chip 11 is mounted on a die pad 12, connected with a lead 15 through a wire 14 and resin-sealed by synthetic resin 10. A metal piece 20 is attached to the synthetic resin 10 by a fitting section 22 to form an air layer 21. Therefore, when a semiconductor device 1 is soldered to a printed board 2, a temperature of a semiconductor device 1 does not rise rapidly even if heated by radiant heat 6 due to existance of the air layer 21. Cracks do not develop due to a stress caused by thermal expansion difference between materials. Thereby, it is possible to prevent disconnection of a wire and lowering of reliability. Furthermore, a metal piece 20 is pressed to bond the metal piece 20 and a synthetic resin 10 after soldering. Thereby, heat dissipation can be improved, and malfunction, characteristics deterioration, and damage of an IC chip can be prevented. |
