发明名称 |
Plastic molded type semiconductor device. |
摘要 |
A first high-power element chip (13) having high current consumption is mounted and fixed of a first bed portion (12) on a heat radiating fin (11) by soldering. A second high-power element chip (17) is mounted and fixed by high-temperature die bonding on a second bed portion (16) formed by denting a part of one end of a lead frame (15) made of a metal thin plate, and an insulating paste (19) is filled between the lower surface of the second bed portion (16) and the upper surface of the first bed portion (12). In addition, a logic element chip (22) is mounted and fixed on one end of another lead frame (20) made of a metal thin plate by a conductive adhesive (23) such as a silver paste. |
申请公布号 |
EP0399447(A2) |
申请公布日期 |
1990.11.28 |
申请号 |
EP19900109666 |
申请日期 |
1990.05.22 |
申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
ISHIGAMI, TOSHIO, C/O INTELLECTUAL PROPERTY DIV. |
分类号 |
H01L23/28;H01L23/433;H01L23/495;H01L25/04;H01L25/18;H01S5/022 |
主分类号 |
H01L23/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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