发明名称 WIRE BONDING
摘要 PURPOSE:To prevent oxidation of a joined surface securely without requiring large-scale equipment and to improve efficiency of bonding operation by supplying heated inert gas only to an area near an end of a bonding tool to heat a bonding wire and the joined surface. CONSTITUTION:While a bonding wire 30 is pressurized to a joined surface 21 at an end of a bonding tool 50, heated inert gas is supplied only to an area near an end of the bonding tool to heat the bonding wire 30 and the joined surface 21. According to this constitution, only a pressurizing section of bonding wire and a joined surface are heated by inert gas at an end of a bonding tool. Thereby, it is possible to realize compactness of equipment, to reduce operational costs, and to improve efficiency of entire bonding operation compared with a heating method with an entire mount substrate placed in an inert atmosphere.
申请公布号 JPH02288345(A) 申请公布日期 1990.11.28
申请号 JP19890109302 申请日期 1989.04.28
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 YAMAMOTO AKIHIRO;MATSUMURA SHINYA;MAKINO YUTAKA;HIRANO MASATO
分类号 H01L21/60;H01L21/603 主分类号 H01L21/60
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