| 摘要 |
PURPOSE:To enhance the reliability of mounting a lead by providing a base material board with a recess incl. a through hole, forming a conductive layer by plating method even on the surface of this recess, and bonding the lead fast to the recess. CONSTITUTION:An alumina ceramic plate 1a as a base material board is provided with a circuit 1b constituting a thermo-module and a through hole 3 for bonding a lead 2. A conductive layer 1b' due to plating is also formed on the inner surface of this through hole 3, and therein the lead 2 is inserted, and the lead 2 is bonded to the thermo-module 1 by soldering 4. Thereby the lead 2 is secured to the thermo-module 1 to lead to enhancement of the reliability in mounting the lead 2. |
