| 摘要 |
PURPOSE: To improve structural stability of a multilayered circuit card structure and to make an integrated circuit and electronic device, efficiently mountable on the structure by forming the structure of a plurality of substrates composed of thermally conductive cores. CONSTITUTION: Each substrate 4, 6, 8, and 10 is provided with a thermally conductive core 12, is coated with an insulating material 18 and has first and second main surfaces. The substrate 4 respectively has metallic patterns 34 and 36 on its main surfaces 18 and 20, and the pattern 34 on the surface 18 is electrically connected to the conductor pattern 36 on the surface 20 through an electrically conducted through-hole 40 and to the substrate 6 by means of an electric connector 42. An electric connector 42' electrically connects a conductor 36' on the substrate 4 to a conductor 44' on the substrate 6, and the conductor 36' is connected to a core 12 through the hole of an insulating layer 20 on the substrate 4. The conductor 44' is connected to the electrically conductive core of the substrate 6 through the hole of an insulating layer 13. Therefore, a multilayered structure which is useful as an electronic circuit card can be obtained. |
