| 摘要 |
<p>A tapered profile is obtained in a plasma glow discharge by varying the temperature of the wafer during the etch. The etch is isotropic while the wafer is hot and is anisotropic when the wafer is cool. The temperature is varied by valves (23-26) which switch temperature controlled fluids through the electrode (13) upon which the wafer (15) rests. By-pass conduits (41, 42) maintain the temperature of the plumbing by enabling continuous fluid flow so that the temperature of the electrode, and of the plumbing connecting it to the valves, stabilizes more rapidly.</p> |
