发明名称 LOW PROFILE MODULAR PHONE JACK ASSEMBLY
摘要 8491-44 A low profile right angle phone jack for use with printed circuit boards is disclosed. The jack includes a dielectric housing member having a modular plug receiving socket formed therein, a forward mating end and a rearward end. The socket is defined by a plug-receiving opening formed in the forward mating end with a lower latch receiving region and extends rearwardly to meet a back surface provided in the housing member. The housing member is mounted with its forward mating end disposed beyond an edge of the printed circuit board. The forward mating end of the housing member is offset downwardly so that the lower latch receiving region of the plug receiving opening is below the upper surface of the circuit board. In addition, the housing member cooperates with the printed circuit board surface to define the socket whereby the upper surface of the circuit board is the bottom surface of the socket. The low profile modular jack is for use with printed circuit boards arranged in modern closely spaced mother-daughter arrangements.
申请公布号 CA1276996(C) 申请公布日期 1990.11.27
申请号 CA19870545503 申请日期 1987.08.27
申请人 MOLEX INCORPORATED 发明人 SILBERNAGEL, RAYMOND A.;FUNCK, GORDON W.
分类号 (IPC1-7):H01R9/09 主分类号 (IPC1-7):H01R9/09
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