| 摘要 |
PURPOSE:To obtain the subject composition, containing a specific epoxy resin, such as hydantoin type, water-soluble substance and amine-based curing agent, capable of providing cured products having excellent strength in using as silicon wafers, etc., and readily disintegrating when poured into water and effectively used as a temporary fixing agent. CONSTITUTION:The objective composition containing (A) an epoxy resin selected from the group consisting of hydantoin type, aliphatic diglycidyl ether type, polyglycidyl ether type and diglycidyl ester type epoxy resins, (B) a water-soluble substance (e.g. NaCl or L-ascorbic acid) and (C) an amine-based curing agent (e.g. diethylenetriamine). Furthermore, the blending ratio is preferably 50-200 pts.wt. component (B) and 5-100 pts.wt. component (C) based on 100 pts.wt. component (A).
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