A semiconductor device for detecting or emitting a magnetic line of force or light and a mold for molding a package.

摘要

A semiconductor device (100) for detecting or emitting a magnetic line of force or light is so provided that the major surface (11) of its built-in semiconductor chip (10) has a predetermined inclination angle (8) relative to a mount surface (91) of a mount substrate (90). An active layer of element (16) for detecting a magnetic line of force or light or an element (24) for emitting a magnetic line of force or light is formed on the major surface (11) of the semiconductor chip. It is, therefore, possible to achieve a smaller mount thickness as defined relative to a mount surface and to detect a magnetic line of force or light coming in a direction parallel to the mount surface or to emit a magnetic line of force or light in a direction vertical to the mount surface.