| 摘要 |
PURPOSE:To acquire such merits as simplification of structure, reduction of manufacturing processes, enhancement of humidity resistance and electrical reliability, etc., by a method wherein a semiconductor pellet is arranged in the central part on a film substrate comprising insulating materials laminated on a metallic sheet while inner leads as they remain electrically isolated from the metallic sheet are arranged around the film substrate. CONSTITUTION:Within a semiconductor device 1 wherein a semiconductor pellet 1 is arranged in the region encircled by the ends of inner leads 3A radially arranged while the outer terminals of the pellet 2 are connected to inner leads 3A to be sealed up with resin 5, the semiconductor pellet 2 is arranged almost in the central part of a film substrate 4; simultaneously, the inner leads 3A are arranged as they remain electrically isolated from the metallic sheets 4B of the substrate 4 on the encircling film substrate 4; and finally the outer terminals of the semiconductor pellet 2 between the outer terminal for power supply and the central part of the metallic sheet 4B of the film substrate 4 as well as the inner leads 3A between the inner lead for power supply and the peripheral part of the metallic sheet 4B are respectively connected by bonding wires 6. |
