<p>Substantially nonconductive or semiconductive surfaces of through-holes can be electroplated directly, without an intervening non-electrolytic metallization, by a stepwise process which includes the application to the through-holes of a polyelectrolyte surfactant in solution in combination with the application of a conductive metal containing material.</p>
申请公布号
EP0398019(A1)
申请公布日期
1990.11.22
申请号
EP19900106755
申请日期
1990.04.09
申请人
INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人
APPEL, BERND K.;BINDRA, PERMINDER;EDWARDS, ROBERT D.;LOOMIS, JAMES R.;PARK, JOE M.;REID, JONATHAN D.;SMITH, LISA J.;WHITE, JAMES R.