| 发明名称 |
Method of manufacturing a thick film resistor element. |
| 摘要 |
<p>A conductive paste layer (12) of less than 5 mu m is formed on an insulating substrate (11). After a drying and a baking treatment of the conductive paste layer, an etching is carried out to form a plurality of electrode pairs (12a, 12b, 12c). Resistor layers (13) are formed corresponding to each pair of the electrodes so as to partially overlap with the electrodes.</p> |
| 申请公布号 |
EP0398572(A1) |
申请公布日期 |
1990.11.22 |
| 申请号 |
EP19900304957 |
申请日期 |
1990.05.08 |
| 申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
NII, MINORU, C/O INTELLECTUAL PROPERTY DIV.;FUKUOKA, YOSHITAKA, C/O INTELLECTUAL PROPERTY DIV. |
| 分类号 |
H01C17/06;H01C7/00;H01C17/065;H01C17/28;H05K1/09;H05K1/16;H05K3/06 |
主分类号 |
H01C17/06 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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