| 摘要 |
PURPOSE:To ensure electrical connection between the metal bumps of a semiconductor chip and a wiring pattern and reduce the rate of mounting defects significantly by a method wherein preliminary heating is applied for bonding the semiconductor chip to the wiring pattern. CONSTITUTION:A wiring pattern 2 is formed on the one surface of a substrate 1. The part of the surface facing a semiconductor chip 5 is coated with insulating resin 6. After the metal bumps 3 of the chip 5 are aligned with the pattern 2, the chip 5 is lightly pressed against the substrate 1. At that time, the substrate 1 is heated a little by a heater 9 to the extent of reducing the viscosity of the resin 6. Then the chip 5 is pressed against the substrate 1 by a bonding tool 7 and heated. The resin 6 whose viscosity is reduced by the preliminary heating is pushed out around the chip 5 by the compression-bonding process as shown by a flow direction 10. At the same time, the chip 5 is bonded to the substrate 1 by the tool 7 and the resin 6 between the bumps 3 and the pattern 2 is pushed aside to provide electrical contacts between the bumps 3 and the pattern 2. With this constitution, the rate of chip mounting defects can be reduced. |
