| 摘要 |
<p>PURPOSE:To suppress the peeling-off of solder plating on the surface of a lead and avoid a short-circuit caused by solder waste and improve the reliability by a method wherein a bending roller is moved along the shape of a die while it is brought into contact with the lead surface and made to rotate to form the lead. CONSTITUTION:A package 1 is held between an ejector pin 3 provided in a first bending die 2 and a pad 4 supported by a spring 15. Then first bending rollers 5 are made to descend and, while they are pressing the upper surfaces of leads 6, made to rotate downward to make the leads 6 vertical to complete first bend forming. Then the package 1 is transferred to a second stage. The package 1 is held by second bending dies 7 on both the sides of the leads 6 and second bending rollers 8 positioned on the lower inside parts of the leads 6 are moved outward to press the leads 6 against the second bending dies 7 to complete second bend forming.</p> |
