| 摘要 |
<p>PURPOSE:To improve orientation property and increase heat resistance by forming an organic piezoelectric pyroelectric film directly on a substrate in a vacuum. CONSTITUTION:In a processing chamber 1, a substrate 3 on which a deposition film of piezoelectric pyroelectric material is formed is retained on a holder 4; the thickness of a film formed on the substrate 3 is measured by a film thickness monitor 5. Facing the substrate 3, a vessel 6 is arranged which is used for evaporating diamine as pyroelectric raw material monomer (a) and di-isocyanate as raw material monomer (b); by an evaporation monitor 7 and a heater 8, the temperature of the vessel 6 is controlled to be a specified value to keep the evaporation of the monomer (a) and (b) always constant. The substrate 3 on which a polyurea film is formed is taken out and heated; electric field is applied to the polyurea film; heating is stopped; the film is gradually cooled and subjected to boring process.</p> |
