| 摘要 |
<p>PURPOSE:To predetermine the line widths of wirings arbitrarily and reduce the impedances of the wirings by a method wherein a second pad region is formed on a first pad region and the wirings are drawn out from the respective pad regions and connected to respective circuits. CONSTITUTION:A ground potential is applied to a bonding pad 11 composed of a wiring layer having a three-layer structure. First layer, second layer and third layer wirings 12, 14 and 16 are drawn out from the pad 11 and connected to the grounding terminals of analog circuits 13, 15 and 17 respectively. With this constitution, the line widths of the wirings 12, 14 and 16 can be arbitrarily predetermined, so that the impedances of the respective wirings can be reduced.</p> |
