发明名称 |
Transport device for wafers of variable diameter |
摘要 |
A transport device for handling wafers of different diameters utilized in the manufacture of semiconductors. A robotic arm is equipped with a fork-shaped wafer support board and an arm slide movable relative to the robotic arm. The fork-shaped end of the support board is provided with fixed pins on one side to support wafers and on another side with plate springs carrying pins which can be depressed by the weight of a wafer to accommodate larger size wafers. The device permits wafers of different diameters accurately and safely to be transferred from its center to a predetermined station without the need for changing the wafer support board or correction of the robotic arm.
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申请公布号 |
US4971512(A) |
申请公布日期 |
1990.11.20 |
申请号 |
US19880285596 |
申请日期 |
1988.12.16 |
申请人 |
KOREA ELECTRONICS TELECOMM;KOREA TELECOMMUNICATION |
发明人 |
LEE, SANG S;KANG, BONG K;PARK, SEUNG K;YOO, HYOUNG J |
分类号 |
H01L21/677;B25J9/04;B25J15/00;H01L21/687 |
主分类号 |
H01L21/677 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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