发明名称 Transport device for wafers of variable diameter
摘要 A transport device for handling wafers of different diameters utilized in the manufacture of semiconductors. A robotic arm is equipped with a fork-shaped wafer support board and an arm slide movable relative to the robotic arm. The fork-shaped end of the support board is provided with fixed pins on one side to support wafers and on another side with plate springs carrying pins which can be depressed by the weight of a wafer to accommodate larger size wafers. The device permits wafers of different diameters accurately and safely to be transferred from its center to a predetermined station without the need for changing the wafer support board or correction of the robotic arm.
申请公布号 US4971512(A) 申请公布日期 1990.11.20
申请号 US19880285596 申请日期 1988.12.16
申请人 KOREA ELECTRONICS TELECOMM;KOREA TELECOMMUNICATION 发明人 LEE, SANG S;KANG, BONG K;PARK, SEUNG K;YOO, HYOUNG J
分类号 H01L21/677;B25J9/04;B25J15/00;H01L21/687 主分类号 H01L21/677
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