| 摘要 |
PURPOSE:To manufacture a highly accuracy luminous element chip array free of aligning pitch and falling errors with a high efficiency by using a particular aligning tool consisting of silicon wafers having plural pyramid-trapezoidal concaved parts. CONSTITUTION:A silicon wafer 5 provided with a plurality of inlet openings larger than and similar in shape to the top of a semiconductor luminous element chip 3 to be aligned, deep bottoms smaller than the top, and concaved parts 6 having a depth smaller than the height of the chip 3, all of which are provided according to a given arrangment plan, is used as an aligning tool. After aligning the chip 3 in place on a conductive adhesive layer 2 on a substrate (e.g., alumina) 1, said silicon wafer 5 is lapped on the chip 3, and chip 3 is precisely pressed in place at the concaved parts 6 and adhered to the substrate 1 to obtain a luminous element chip array. Said silicon wafer 5 can be easily formed formed by etching anisotropically a silicon plate of crystal plane (110). |
