| 摘要 |
PURPOSE:To moderate the deformation of fine metal wires at sealing and attain a supermulti-pin construction by a method wherein the ends of inner leads are so arranged and connected as to enable the fine metal wirings to be connected in a direction in parallel with the flow direction of sealing resin. CONSTITUTION:An island 6 supported by suspending leads 3, a semiconductor chip 9 mounted on the island 6, electrode pads 9 arranged at the periphery of the semiconductor 8 at a regular interval, and inner leads 2 arranged around the island 6 and connected to the electrode pads 9 through fine metal wires 10 so as to make the fine metal wires 10 parallel with the flowing direction of sealing resin are provided to constitute an intermediate product. Then, the intermediate product is fitted to a sealing mold, and sealing resin is forcibly injected toward the upper right corner from a sub-runner 13 via a sealing gate 12. However, as the fine metal wires 10 are arranged in parallel with a direction in which the resin flows, force acting on the fine metal wires 10 is lessened in pushing them in a lateral direction, so that the fine metal wires are protected against short circuit and disconnection.
|
