SUPPORTING BLOCK OF WAFER OF EXPOSURE APPARATUS

摘要

PURPOSE:To enable execution of focusing in a short time irrespective of the thickness distribution of a wafer by bringing the wafer into close contact with the other main surface of glass of a projection-type exposure apparatus by using a shock absorbing material. CONSTITUTION:A wafer 13 for exposure is brought into close contact with the other main surface of glass 14 of a projection-type exposure apparatus by using a shock absorbing material 12. More particularly, the wafer 13 is brought into close contact with silica glass 14 by a spring 15 with a wafer chuck 12 interposed. Since the wafer chuck 12 is the shock absorbing material made of rubber, it operates to mitigate sufficiently a shock given to the wafer 13. Thus, a pattern can be transferred onto the wafer in a short time with excellent reproducibility, irrespective of nonuniformity in the thickness of the wafer.