| 摘要 |
PURPOSE: To reduce problem of outflow of a die mount material, by forming a plurality of walls that surround a die mount region to form a die-cavity, and providing a notched region to at least one of the walls. CONSTITUTION: Various layers placed on a base layer 28 form a die-cavity 40 with a die 26 placed therein and form walls 38 that surround a die mount region 30. The walls 38 include a wire bond shelf 42 with bonding posts placed thereon, a notched region 44 is placed under the wire bond shelf 42, and the notched region 44 acts like a region to which an excess die mount material 46 flows. Thus, the excess die mount material 46 is not flowed to a highest part of the die 26 nor onto the wire bond shelf and then wire bonding is facilitated. Thus, problem of outflow of the die mount material is reduced and occurrence of a defective package is prevented.
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