INTERCONNECT DEVICE AND METHOD OF MANUFACTURE THEREOF

摘要

INTERCONNECT DEVICE AND METHOD OF MANUFACTURE THEREOF of the Invention: An interconnect device for electronic components, such as integrated circuits, multichip modules and the like, and the method of manufacture thereof are presented. The interconnect device has two layers of circuitry, one for signal transmission and one for voltage plane. The interconnect device is made by a processing on a stainless steel carrier plate to achieve high lead count capability with fine line widths and spacing, as well as precise registration layer to layer. Laser drilling is used to define interconnect vias between signal and voltage (power or ground) plane layers.